【英文标准名称】:Fibreopticactivecomponentsanddevices-Packageandinterfacestandards-Part11:14-pinmodulator-integratedlaserdiodetransmitters
【原文标准名称】:环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN
【标准号】:BSEN62148-11-2003
【标准状态】:作废
【国别】:英国
【发布日期】:2004-01-08
【实施或试行日期】:2004-01-08
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:电气工程;光学纤维;光波导;纤维光学;光电子学;界面;激光二极管;电子工程;无线电收发信机;元部件;半导体;试验;测量技术
【英文主题词】:Components;Electricalengineering;Electronicengineering;Fibreoptics;Interfaces;Laserdiodes;Measuringtechniques;Modules;Opticalfibres;Opticalwaveguides;Optoelectronics;Semiconductors;Testing;Transceivers
【摘要】:ThispartofIEC62148coversphysicalinterfacespecificationformodulatorintegratedlaserdiodetransmitters.TheintentofthispartofIEC62148istoadequatelyspecifythephysicalrequirementsofanopticaltransmitterthatwillenablemechanicalinterchangeabilityoftransmitterscomplyingwiththisstandardbothatthePCBandforanypanelmountingrequirement.
【中国标准分类号】:M33
【国际标准分类号】:33_180_20
【页数】:13P.;A4
【正文语种】:英语


Product Code:SAE AMS2690
Title:Parallel Gap, Welding, Microelectronic Interconnections to Thin Film Substrates (NONCURRENT)
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.